About TiSC | About Us
About Us
About TiSC
Innovate the way we perceive the world
Welcome to TiSC, where we define the new standard of Physical AI through the intelligence of light.
Rooted in our deep heritage of semiconductor design—spanning from Application Processors (AP) and Image Signal Processors (ISP) to Wireless Communication and High-speed Transmission solutions—we have consistently pushed the boundaries of integrated technology. Building on this foundational expertise in HDL, hardware, and software, we have evolved to create EchoVu, a transformative device that transcends conventional sensing.
At TiSC, our strength lies in our comprehensive in-house capabilities. By merging the precision of 3D depth with the intelligence of On-device AI, we empower infrastructures to see, understand, and act autonomously. We don't just capture images we provide cognitive perception of the physical world.
Guided by our mission to secure the future of smart cities and industries, we persistently innovate to turn complex spatial data into life-saving insights. Our journey has always been driven by a singular destination: creating technology that makes the world smarter and safer.
We are TiSC. We make light think.
2015
11 Established TiSC
2016
03 Established Corporate R&D Center
2020
08 Launched LICAS 7Eye
2022
04 Participated in AI Expo of KOREA
2023
02 Launched LiCAS-II
2024
02 Participated in MWC Barcelona 2024
08 Launched EchoVu and AyNIS
10 Participated in GITEX GLOBAL 2024
2025
06
Field Validation of Logistics & Industrial Facility
Safety at a logistics company in JeonJu
07 Seoul Deep Tunnel Restricted Vehicle Entry Alarm System
CEO & Founder
Hyun-il Kim
Technical Heritage: Led the development of communication modem chips and base station semiconductors at LG Electronics.
Semiconductor Mastery: Spearheaded image processor design at MTEKVISION and developed application processors (AP) at H-Technology.
Entrepreneurial Vision: Founded TiSC in 2015, translating decades of chip-level expertise into autonomous spatial intelligence solutions.
CBO & Co-Founder
In-won Chae
System Integration: Expert in image semiconductor design and technical business support at MTEKVISION.
Full-Stack Development: Directed image processing semiconductor and software development at H-Technology.
Business Strategy: Co-founded TiSC in 2015, ensuring the seamless integration of cutting-edge technology with market-leading solutions.
CTO & Head of R&D
Tae-jung Jung
Connectivity Pioneer: Developed 3GPP2 CDMA and advanced wireless standards including IEEE 802.11p (Wi-Fi) and IEEE 802.16e (WiMAX) at I&C Technology.
Future Mobility Leader: Led the development of IEEE 1609 V2X WAVE technology at Chemtronics, providing the critical link for autonomous infrastructure.
Technological Edge: Joined TiSC in 2019 to fortify the EchoVu ecosystem with robust communication and sensing reliability.
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